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You Searched For: Copper+(I)+sulphide


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(Trifluoromethylsulfonyloxy) copper(I) 98%

Supplier: Ambeed
Description: (Trifluoromethylsulfonyloxy) copper(I), Purity: 98%, CAS Number: 42152-44-3, Appearance: Solid, Storage: Inert atmosphere, Room Temperature, Size: 5g

Image Unavailable-AA43038-KS

Copper ≥99.995% (metals basis), sputtering target, Diameter 50.8 mm (2.0 in), Thickness 3.18 mm (0.125 in)

Catalog Number: (AA43038-KS)
Supplier: Thermo Scientific Chemicals
Description: Magnetron sputtering source

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Image Unavailable-AA43039-KS

Copper ≥99.995% (metals basis), sputtering target, Diameter 50.8 mm (2.0 in), Thickness 6.35 mm (0.250 in)

Catalog Number: (AA43039-KS)
Supplier: Thermo Scientific Chemicals
Description: MDL: MFCD00010965 Notes: Thickness tolerance: +/- 0.015in. Diameter tolerance: +0.020/-0.0in

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Image Unavailable-AA12135-30

Copper(I) cyanide

Supplier: Thermo Scientific Chemicals
Description: Electroplating Cu or Fe, polymerization catalyst

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Product Image-TS21242-1000

Copper(I) chloride 99.99% (trace metals basis), Extra Pure

Supplier: Thermo Scientific Chemicals
Description: Copper(I) chloride 99.99% (trace metals basis), Extra Pure

Product Image-TS25855-0010

Copper (II) ethylenediamine complex 1 M in water

Supplier: Thermo Scientific Chemicals
Description: Copper (II) ethylenediamine complex 1 M in water

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Copper etchant 49-1 semiconductor grade

Supplier: Transene
Description: Copper Etchant 49-1 is a highly selective, moderate etch rate copper etchant. Will not attack photoresist or other metals, including nickel.

Image Unavailable-AAAL07705-AE

Borane dimethyl sulfide complex 94%

Supplier: Thermo Scientific Chemicals
Description: BMS Borane-methyl sulphide Dimethyl sulphide borane. Grade:94, Melting Point C-40 to -37*. Boiling Point C:ca 44*[degree]C. C2H9BS. 13292-87-0. Contains ca 4% excess dimethyl sulphide. May develop pressure. HIGHLY FLAMMABLE HARMFU

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Image Unavailable-AAAA14436-0E

Copper(I) oxide 97%

Supplier: Thermo Scientific Chemicals
Description: 500g CAS: 1317-39-1, MDL: MFCD00010974

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Image Unavailable-BT135145-2KG

Copper ≥99.9% (trace metals basis), shot 1-10 mm

Supplier: BeanTown Chemical

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Image Unavailable-76540-924

Copper etchant CE-100 semiconductor grade

Supplier: Transene
Description: Copper Etchant CE-100 is a fast etch for removal of thicker copper films.

Image Unavailable-BT213665-500G

Copper ≥99.9% (trace metals basis), flakes 1-5 µm

Supplier: BeanTown Chemical
Description: CAS: 7440-50-8; EC No: 231-159-6; MDL No: MFCD00010965 UN No: UN3089; Haz Class: 4.1; Packing Group: III Solid; Molecular Formula: Cu; MW: 63.55 Melting Point: 1083.4°; Boiling Point: 2567° Density (g/mL): 8.94

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Image Unavailable-EM1.02703.1000

Copper, fine powder, EMSURE® < 63 µm for analysis, Supelco®

Catalog Number: (EM1.02703.1000)
Supplier: MilliporeSigma
Description: Cas Number 7440-50-8

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Product Image-97065-032

Copper(II) sulfate pentahydrate ACS

Supplier: VWR
Description: Copper(II) sulphate pentahydrate ACS

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Product Image-TS20839-1000

Copper(I) chloride 99%, Extra Pure, purified

Supplier: Thermo Scientific Chemicals
Description: Copper(I) chloride 99%, Extra Pure, purified

Image Unavailable-77152-646

Copper(I) diphenylphosphinate 90%

Supplier: Ambeed
Description: Copper(I) diphenylphosphinate, Purity: 90%, CAS Number: 1011257-42-3, Appearance: Form: solid, Storage: Inert atmosphere, Room Temperature, Size: 25g

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Stock for this item is limited, but may be available in a warehouse close to you. Please make sure that you are logged in to the site so that available stock can be displayed. If the call is still displayed and you need assistance, please call us at 1-800-932-5000.
This product is marked as restricted and can only be purchased by approved Shipping Accounts. If you need further assistance, email VWR Regulatory Department at Regulatory_Affairs@vwr.com
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