PrecISIon Diamond Wafering Saw Blades, Electron Microscopy Sciences

Supplier: Electron Microscopy Sciences
50266-CL7 50266-MH3 50266-MH4 50267-CH4 50265-MH3 50265-CH5 50265-CL6 50265-MH4 50265-CH4 50265-FH4 50265-MH7 50266-CH4 50266-CH7 50267-MH4 50265-MH5 50265-CH6 50265-CL5 50265-CL4 50265-FH3 50266-FH4 50267-FH4 50265-CH7 50265-ML3
101411-830EA 906.94 USD
101411-830 101411-834 101411-836 101411-838 101411-818 101411-804 101411-812 101411-820 101411-802 101411-816 101411-824 101411-826 101411-828 101411-842 101411-822 101411-806 101411-810 101411-808 101411-814 101411-832 101411-840 102092-782 102092-784
PrecISIon Diamond Wafering Saw Blades, Electron Microscopy Sciences
Razors and Blades
These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles

High Concentration (H/C) blades are for general laboratory use, either low or high saw’s speed while low concentration (L/C) blades are for sectioning hard and brittle materials, such as ceramics, silicon, glass, minerals.

These blades come in high and low concentrations of diamond particles to handle various sectioning requirements.
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